Ultrathin hub blades for stable dicing of narrow street wafers Electroformed bond Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, etc.), etc ZHZZ series hub blades were ...

Achieves continuous, high-quality processing of oxide wafers Electroformed bond Applications: Oxide wafers (LiTaO3, etc.), etc The ZHFX Series employs a bond that has ideal wear properties for ...

Provides stable processing through increased blade edge deformation resistance Electroformed bond Applications: Silicon wafer, etc For relatively thick blades in excess of 60 ...

Provides stable processing through high-accuracy concentration control Electroformed bond Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, etc.), Oxide wafers (LiTaO3, etc.), ...

Protects wheel segments for streamlined wheel replacement and easier handling.

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High precision products to facilitate stable production from tape mounter to die bonder. Meets the ø300 mm wafer SEMI standard.

High yield and high throughput separation of small die processed with Stealth Dicing™ Φ200 mm SDTT Reliable separation of small die wafers The DDS2010 offers an integrated ...

Fully-automatic surface planer for Φ300 mm wafers
Φ300 mm 2 axes, 2 chuck tables Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO ...

Fully-automatic surface planer for Φ8-inch wafers
Φ200 mm 1 axis, 1 chuck table Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO ...

Semi-automatic surface planer for Φ8-inch wafers Φ200 mm 1 axis, 1 chuck table Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO surface ...

Realizes faster processing of ultrathin wafers Φ300 mm DBG SDBG Wafer Thinning Realizes high yield thin wafer processing The DFM2800 is a specialized wafer mounter for inclusion ...

High-efficiency grinder/polisher for Φ300 mm wafers Φ300 mm 3 axes, 4 chuck tables DBG SDBG Wafer Thinning Stress Releaf Realizes improvements in process stability and higher ...